IEEE PerCom is the premier annual scholarly venue in pervasive computing and communications. Pervasive computing has been and is still a very active research area, finding its way into many commercial and consumer systems and applications due to tremendous advances in a broad spectrum of technologies and topics such as wireless networking, mobile, and distributed computing, sensor and actuator systems, ambient intelligence, and smart mobile and embedded devices. Due to the pervasiveness of such systems, users become central in the development and realization of innovative pervasive systems. Advances in all these fields have led to innovative platforms, protocols, systems, and applications but still, a lot can be done to improve their quality, sustainability, and acceptance and new solutions can be further proposed.
In 2026, PerCom will be held in Pisa, Italy, as an entirely in-person event.
The Work in Progress (WiP) session provides an opportunity to present and discuss new challenges and visions, showcase early research results, and explore novel research directions. The specific aim of the WiP session is to provide a forum for timely presentation, discussion and feedback for novel, controversial, and thought-provoking ideas. Contributions are solicited in all areas of pervasive computing research and applications.
Papers are expected to report on early or ongoing research on any aspect of pervasive computing and communications, and should clearly document how they relate to these topics. Preliminary experimental results are appreciated. Given their nature, WiP papers are expected to also highlight concrete future directions.
Accepted papers will be included in PerCom Workshops proceedings to be published by IEEE and included in the IEEE Xplore digital library. An award will be given to the Best WiP contribution, based on submissions and presentations.
Topics of interest include, but are not limited to:
- Foundational Theory and Modeling: Context modelling and reasoning, Programming paradigms for pervasive computing, Spatio-temporal modeling techniques, Complex networks, Adaptive computing, Activity and emotion recognition.
- Machine Learning and Artificial Intelligence for Pervasive Computing: Machine learning and deep learning applications in pervasive computing, Federated learning and Edge AI for pervasive computing, Causal learning, Cognitive computing, Large Language
Models for pervasive computing. - Pervasive System Infrastructure and Architecture: Middleware systems and services, Clouds, fog and edge computing, Data engineering for pervasive computing, Integrations of smartphones in pervasive experiences.
- Devices, Sensors, and Hardware: Mobile and wearable systems, IoT and sensor systems, RFID systems, Smart devices and environments, Energy-harvesting, self-powered, or battery-less systems, Wireless crowd-recharging, Positioning and tracking technologies, Device-free human sensing.
- Networking and Coordination: Opportunistic networks, Device-to-device coordination, Architectures and protocols for pervasive communications, 3D networks.
- Human Factors and Social Computing: User interface, interaction, and persuasion, Participatory and social sensing, Online and offline social networking, Trust, security, and privacy, Human-machine collaboration, Ethical aspects of pervasive computing.
- Application Domains: Healthcare and well-being applications, Smart homes and virtual assistants, Urban/mobile crowdsensing and intelligence, Augmented/Virtual Reality, Cyber-physical systems, Innovative applications (sports analytics, crime prevention, pervasive nowcasting), Urban Robotics, Smart Vehicles, Disaster Sensing/Management, PerCom for space applications, Pervasive data
science.
Submission Instructions
Paper submissions must be made via edas. The direct submission link for the PerCom 2025 Work-in-Progress track is https://edas.info/N34022; paper submissions will be possible from September 1, 2025.
Authors are invited to submit original, unpublished manuscripts in two-column IEEE proceedings style in PDF format (no more than 4 pages including figures, tables, and references, US letter paper size, i.e., 8.5×11 inches). PerCom WIP will follow a single-blind policy (i.e., all authors’ contact information must be included on the first page). The official IEEE manuscript template for conference proceedings, as well as more detailed formatting instructions, can be found at https://www.ieee.org/conferences/publishing/templates.html. All submitted manuscripts will be reviewed by the WiP Technical Program Committee.
Accepted papers must be presented in person during the main conference’s poster session by one of the authors. At least one author of each WiP paper must have a full conference registration, with one registration covering up to two papers. Failure to comply with this requirement will result in the exclusion of the paper from the final proceedings, the conference program and from the IEEE Digital Library, and the paper will not be eligible for the Best WiP Paper Award.
Important Dates
Submission Deadline: 17 November 2025, 23:59 AoE
Notification of Acceptance: 12 January 2026, 23:59 AoE
Camera Ready Deadline: 2 February 2026, 23:59 AoE
For more information, check the PerCom Important Dates page.
WiP Chairs
Tristan Braud, Hong Kong University of Science and Technology, Hong Kong
Andreas Reinhardt, TU Clausthal, Germany
Program Committee Members
Christine Bassem, Wellesley College
Alex Cabral, Georgia Tech
Sandip Chakraborty, Indian Institute of Technology Kharagpur
Mathias Ciliberto, University of Cambridge
Gabriele Civitarese, University of Milan
Donghui Dai, The Hong Kong Polytechnic University
Yi Ding, University of Texas at Dallas
Janick Edinger, University of Hamburg
Indrajeet Ghosh, University of Maryland Baltimore County
Yanqiu Huang, University of Twente
Abdelwahed Khamis, CSIRO
Christian Krupitzer, Universität Hohenheim
Abhishek Kumar, University of Jyväskylä
Stephen Lee, University of Pittsburgh
Marco Levorato, University of California, Irvine
Tamer Nadeem, Virginia Commonwealth University
Nobuhiko Nishio, Ritsumeikan University
Daniele Puccinelli, University of Applied Sciences and Arts of Southern Switzerland (SUPSI)
Vitor Rey, Deutsches Forschungszentrum für Künstliche Intelligenz
Anna Lina Ruscelli, Scuola Superiore Sant’Anna
Gregor Schiele, University of Duisburg-Essen
Argha Sen, Indian Institute of Technology Kharagpur
Geethapriya Thamilarasu, University of Washington Bothell
Lorenzo Valerio, IIT-CNR
Hirozumi Yamaguchi, The University of Osaka
Juan Ye, University of St Andrews
JinYi Yoon, Virginia Tech
Kristina Yordanova, University of Greifswald