The Work in Progress (WiP) session provides an opportunity to present and discuss new challenges and visions, showcase early research results, and explore novel research directions. The specific aim of the WiP session is to provide a forum for timely presentation, discussion and feedback for novel, controversial, and thought-provoking ideas. Contributions are solicited in all areas of pervasive computing research and applications. Papers are expected to report on early or ongoing research on any aspect of pervasive computing and communications. Preliminary experimental results are appreciated.
All selected papers must be presented. They will be included in PerCom Workshops proceedings to be published by IEEE and included in the IEEE Xplore digital library. The WiP Chairs and the WiP Program Committee will also select the best WiP contribution based on submissions and presentations.
Topics of interest include, but are not limited to:
- Advances in pervasive systems and infrastructures: middleware systems and services; data engineering for pervasive computing; clouds, fog and edge computing; integrations of smartphones in pervasive experiences; applications of device-to-device coordination
- Theories, models, and algorithms: context modeling and reasoning; adaptive computing; activity and emotion recognition; programming paradigms; applied machine learning; deep machine learning; federated learning; casual learning; cognitive computing; complex networks; spatio-temporal modeling techniques
- Domain-specific challenges and novel applications: urban/mobile crowdsensing & intelligence; PerCom for healthcare and well-being; cyber-physical PerCom; smart homes and virtual assistants; innovative PerCom applications (e.g., sports analytics, crime prevention, pervasive nowcasting)
- Intersections of PerCom with: opportunistic networks; IoT and sensor systems; RFID systems; pervasive data science, cyber physical systems
- New techniques for user-level concerns: participatory and social sensing; trust, security, and privacy; user interface, interaction, and persuasion; online and offline social networking and pervasive computing
- Technological innovations: architectures, protocols, and technologies for pervasive communications; energy-harvesting, self-powered, or battery-less systems; mobile and wearable systems; smart devices and environments; positioning and tracking technologies; wireless crowd-recharging; device-free human sensing
Submission Guidelines
Paper submission must be done for the main conference and all associated events via EasyChair. If you do not have an EasyChair account, please, register first and create an account (it’s free) via the following link: register. The direct submission link for PerCom 2025 is https://easychair.org/conferences/?conf=percom2025; paper submission will be active from September 5. Select “Work in Progress Papers” from the list of tracks to submit papers to the main conference.
Authors are requested to submit original, unpublished manuscripts in standard IEEE proceedings format (two-column format with a 4-page limit including figures, tables, and references, US letter size (8.5 by 11 inches)) in PDF format. PerCom WIP will follow a single-blind policy (include all author’s information). The official IEEE manuscript templates for conference proceedings, as well as more detailed formatting instructions, can be found at https://www.ieee.org/conferences/publishing/templates.html. All submitted manuscripts will be reviewed by the WiP Technical Program Committee. The authors of accepted papers will present their work during the main conference. At least one author must have a full conference registration.
All manuscripts must be registered and submitted through the EasyChair submission site prior to the submission deadline.
Important Dates
Submission Deadline: December 8, 2024, 23:59 AoE
Notification of Acceptance: January 8, 2025, 23:59 AoE
Camera Ready Deadline: February 2, 2025, 23:59 AoE
For more information, check the PerCom Important Dates page.
WiP Chairs
- Brent Lagesse, University of Washington – Bothell, USA
- Stephen Lee, University of Pittsburgh, USA