{"version":"1.0","provider_name":"IEEE International Conference on Pervasive Computing and Communication","provider_url":"https:\/\/percom.org\/2025","author_name":"anuradha","author_url":"https:\/\/percom.org\/2025\/author\/anuradha\/","title":"Accepted Papers (Industry Track) - IEEE International Conference on Pervasive Computing and Communication","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"vvMzLY2IrV\"><a href=\"https:\/\/percom.org\/2025\/accepted-papers-industry-track\/\">Accepted Papers (Industry Track)<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/percom.org\/2025\/accepted-papers-industry-track\/embed\/#?secret=vvMzLY2IrV\" width=\"600\" height=\"338\" title=\"&#8220;Accepted Papers (Industry Track)&#8221; &#8212; IEEE International Conference on Pervasive Computing and Communication\" data-secret=\"vvMzLY2IrV\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script>\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/percom.org\/2025\/wp-includes\/js\/wp-embed.min.js\n<\/script>\n","description":"Designing Silver Conductive Ink S-Curve Interconnects for Bio-potential Monitoring E-Textiles via Material Deposition Fabrication Sonya Patel (Humber Polytechnic), Vlad Porcila (Humber Polytechnic), Alfonso Miguel Alvaran (Humber Polytechnic), Jeremy Nugara (Humber Polytechnic), Ahsan Abdullah (Humber Polytechnic), Adriana Ieraci (Toronto Metropolitan University), Sharon Gabison (University of Toronto), Jane Batt (Unity Health Toronto), Alireza Sadeghian (Toronto Metropolitan University),"}