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| TECHNICAL PROGRAM COMMITTEEOzgur Akan, Middle East Technical University, TurkeyGiuseppe Anastasi, University of Pisa, ItalyStefano Basagni, Northeastern University, USAChristian Becker, Universität Mannheim, GermanyJoel Branch, IBM Research, USAFabian Bustamante, Northwestern University, USATiziana Calamoneri, University of Rome "Sapienza", ItalyRoy Campbell, University of Illinois at Urbana-Champaign, USAGuohong Cao, Pennsylvania State University, USAJiannong Cao, Hong Kong Polytechnic University, Hong KongPaul Castro, IBM T.J. Watson Research Center, USAMun Choon Chan, National University of Singapore, SingaporeHao-hua Chu, National Taiwan University, TaiwanMarco Conti, IIT-CNR, ItalyDiane Cook, Washington State University, USASajal Das, The University of Texas at Arlington, USANigel Davies, Lancaster University, UKLuca Delgrossi, Mercedes-Benz Research and Development, USAJonathan Engelsma, Motorola, Inc., USAAlois Ferscha, University of Linz, AustriaMorten Fjeld, Chalmers University of Technology, SwedenEric Fleury, ENS Lyon / INRIA, FranceChristian Floerkemeier, MIT, USAHans Gellersen, Lancaster University, UKMario Gerla, University of California at Los Angeles, USATao Gu, Institute for Infocomm Research, SingaporeXiaohui Gu, North Carolina State University, USAJonna Hakkila, Nokia, FinlandQi Han, Colorado School of Mines, USARobert Harle, University of Cambridge, UKSeongsoo Hong, Seoul National University, KoreaJadwiga Indulska, University of Queensland, AustraliaYu Jiao, Oak Ridge National Laboratory, USAVana Kalogeraki, University of California, Riverside, USAHolger Karl, University of Paderborn, GermanySneha Kasera, University of Utah, USATimo Kosch, BMW, GermanyPolychronis Koutsakis, McMaster University, CanadaBhaskar Krishnamachari, University of Southern California, USAMohan Kumar, The University of Texas at Arlington, USARodger Lea, University of British Columbia, CanadaBen Lee, Oregon State University, USADongman Lee, Information and Communications University, KoreaYunhao Liu, Hong Kong University of Science and Technology, Hong KongPaul Lukowicz, University of Passau, GermanyXun Luo, Qualcomm Inc, USACecilia Mascolo, University of Cambridge, UKMartin Mauve, Heinrich Heine University Düsseldorf, GermanyScott Midkiff, Virginia Tech, USAArchan Misra, IBM Research, USAMatt Mutka, Michigan State University, USATamer Nadeem, Siemens Corporate Research, Inc., USADaniela Nicklas, Carl von Ossietzky Universitaet Oldenburg, GermanyJoerg Ott, Helsinki University of Technology, FinlandMax Ott, NICTA, AustraliaSymeon Papavassiliou, National Technical University of Athens, GreeceJong Hyuk Park, Kyungnam University, KoreaAndrea Passarella, IIT-CNR, ItalyGiovanni Pau, University of California Los Angeles, USAChiara Petrioli, University of Rome "La Sapienza", ItalyTom Pfeifer, Waterford Institute of Technology, TSSG, IrelandGian Pietro Picco, University of Trento, ItalyGopal Pingali, IBM Research, USAClaudio Pinhanez, IBM Research, USAAaron Quigley, University College Dublin, IrelandMandayam Raghunath, Google, IndiaNishkam Ravi, Intel, Santa Clara, USAKay Roemer, ETH Zurich, SwitzerlandMichael Rohs, Deutsche Telekom Laboratories, TU Berlin, GermanyMarcel Rosu, IBM Research, USAKurt Rothermel, University of Stuttgart, GermanyGeorge Roussos, Birkbeck College, University of London, UKAntony Rowstron, Microsoft Research, UKEnrico Rukzio, Lancaster University, UKIchiro Satoh, National Institute of Informatics, JapanGregor Schiele, University of Mannheim, GermanyJames Scott, Microsoft Research, UKMitali Singh, University of Southern California, USAWen-Zhan Song, Washington State University, Vancouver, USADanny Soroker, IBM Research, USADaby M. Sow, IBM Research, USAMani Srivastava, University of California, Los Angeles, USAVincent Stanford, National Institute of Standards and Technology, USAIoannis Stavrakakis, National and Kapodistrian University of Athens, GreeceIvan Stojmenovic, University of Ottawa, CanadaThomas Strang, DLR Oberpfaffenhofen, GermanyViolet Syrotiuk, Arizona State University, USASameer Tilak, University of California at San Diego, USAAnand Tripathi, University of Minnesota, USAGerhard Tröster, Wearable Computing Lab ETH Zürich, SwitzerlandKristof Van Laerhoven, TU Darmstadt, GermanyAthanasios Vasilakos, University of Western Macedonia, GreeceLi Xiao, Michigan State University, USADavid Yates, Bentley College, USAFranco Zambonelli, University of Modena and Reggio Emilia, ItalyGergely Záruba, University of Texas at Arlington, USADaqing Zhang, GET/INT-National Institute of Telecommunications, France
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