Work In Progress

Submission deadline extended to December 1st, 2014 (11:59 pm AoE, GMT/UTC-12:00)

The Work-in-Progress (WiP) session provides an opportunity to present and discuss new challenges and visions, showcase early research results, and explore novel research directions. The specific aim of the WiP session is to provide a forum for timely presentation, discussion and feedback for novel, controversial, and thought-provoking ideas. All selected papers will be presented as posters in a special conference session following a 1-minute madness oral presentation. In addition, all selected papers will be included in PerCom Workshops proceedings to be published by IEEE and included in the digital library.

Contributions are solicited in all areas of pervasive computing research and applications. Papers are expected to report on early or ongoing research on any aspect of pervasive computing and communications. Preliminary experimental results are appreciated.


Topics of interest include, but are not limited to:

  • Innovative pervasive computing applications
  • Software engineering aspects of pervasive computing
  • Middleware services and agent technologies
  • Pervasive computing for smart environments
  • Energy-efficient and green pervasive computing
  • Wearable systems
  • Smart City systems
  • Internet of Things
  • Enabling technologies for pervasive systems (e.g., wireless BAN, PAN)
  • Multimodal sensing and data fusion for pervasive applications
  • Mobile phone sensing applications
  • Communication architectures for pervasive computing
  • Ad hoc networks for pervasive communications
  • Sensors and RFID in pervasive systems
  • Pervasive opportunistic communications and applications
  • Pervasive sensing, perception and semantic interpretation
  • Mobile peer-to-peer and distributed systems for pervasive computing
  • Adaptive, autonomic and context-aware computing
  • Positioning and tracking technologies
  • Virtual and immersive systems for pervasive environments
  • Social and economics aspects of pervasive computing
  • New challenges and visions of pervasive world

Technical Program Committee

Sheikh Ahamed "Marquette University, USA"
Carlo Alberto Boano "TU Graz, Austria
Egemen Çetinkaya "Missouri University of Science and Technology, USA"
Geoffrey Challen "University at Buffalo, State University of New York, USA"
Domenico Giustiniano "IMDEA Networks Institute, Spain"
Omprakash Gnawali "University of Houston, USA"
Mauro Iacono "Seconda Università degli Studi di Napoli, Italy"
Pratik Maheshwari "Apple, USA"
Daniel Menasche "Federal University of Rio de Janeiro, Brazil"
Sami Rollins "University of San Francisco, USA"
Christian Skalka "University of Vermont, USA"
Aaron Striegel "University of Notre Dame, USA"
Rajesh Subramanyan "Siemens, USA"
Shaun Wagner "Medical University of South Carolina, USA"
Mohammad Zulkernine "Queen's University, Canada"
Marco Zuniga "Delft University of Technology, Netherlands"

Submission Guidelines

Authors are requested to submit original, unpublished manuscripts in standard IEEE proceedings format (two-column format with a 4-page limit including figures, tables, and references) in PDF format that include contact information of all the authors to the EDAS submission site.

The submitted manuscripts will be reviewed by the WiP Program Committee. The authors of accepted papers will present their work during the main conference in a special WiP poster session and must register for the conference. The papers of the WiP session will be published in the workshop proceedings of the 12th Annual IEEE International Conference on Pervasive Computing and Communications.

Poster Size: The minimum is 20" x 30" (508 mm x 763 mm) up to about 25% more in each dimension.

Important Dates (tentative)

Paper Submissions: November 21st, 2014 December 1st, 2014 (11:59 pm AoE, GMT/UTC-12:00)
Notification of acceptance: December 19th, 2014
Camera-ready copy due: January 22nd, 2015
Conference date: March 23rd - 27th, 2015

IEEE PerCom 2015 WiP Chairs

Sahra Sedigh Sarvestani, Missouri University of Science and Technology (USA)
Daniele Puccinelli, University of Applied Sciences of Southern Switzerland